Packaging Module Development Engineer
USonsitemid$134K – $189K
Posted today · via Workday
About this role
Job Details: Job Description: Join Intel's Advanced Packaging Technology Development team as a Packaging Module Development Engineer. In this pivotal role, you will shape the future of advanced IC packaging solutions by driving process and equipment innovations critical to Intel's roadmap for assembly packaging platform technologies. Your contributions will empower the manufacturability of next-generation products, ensuring they meet stringent quality, reliability, cost, yield, and productivity requirements. As part of a collaborative and forward-thinking team, you'll tackle complex challenges, develop cutting-edge methods, and push the boundaries of what's possible in packaging technology.…
What we'd score you on
reqspace match rubricFive dimensions, recruiter-grade. Upload your resume and we'll generate a written explanation of where you fit and where the gaps are.
1
Skills match
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2
Level fit
This role is mid-level. We check your trajectory against it.
3
Domain experience
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4
Recency
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5
Location fit
This role is based in US. We weight your proximity and willingness to relocate.
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teams
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