Packaging Module Development Engineer

USonsitemid$134K$189K

Posted today · via Workday

About this role

Job Details: Job Description: Join Intel's Advanced Packaging Technology Development team as a Packaging Module Development Engineer. In this pivotal role, you will shape the future of advanced IC packaging solutions by driving process and equipment innovations critical to Intel's roadmap for assembly packaging platform technologies. Your contributions will empower the manufacturability of next-generation products, ensuring they meet stringent quality, reliability, cost, yield, and productivity requirements. As part of a collaborative and forward-thinking team, you'll tackle complex challenges, develop cutting-edge methods, and push the boundaries of what's possible in packaging technology.…

Read the full description on 500 Intel Ireland's site →

What we'd score you on

reqspace match rubric

Five dimensions, recruiter-grade. Upload your resume and we'll generate a written explanation of where you fit and where the gaps are.

1

Skills match

For this role: teams

2

Level fit

This role is mid-level. We check your trajectory against it.

3

Domain experience

Your work in the role's domain matters more than your years total. We weight recent and direct experience.

4

Recency

A skill you used last quarter weighs more than one from five years ago. We grade on recency, not lifetime.

5

Location fit

This role is based in US. We weight your proximity and willingness to relocate.

Score yourself on this role.
Free · no card · written explanation included
See if I'm a fit →

Skills in this role

Pulled from the job description. These are the keywords we'll weight when scoring your fit.

teams

More at 500 Intel Ireland

See all open jobs at 500 Intel Ireland