Senior IC packaging engineer, IC package technologies

Annapurna Labs is a semiconductor company established by semiconductor industry veterans and is now part of Amazon Web Services (AWS). We are developing leading edge products, manufactured on leading edge technologies. We offer a dynamic, open, teamwork environment operating at high pace mode. Key job responsibilities – Assume full ownership of mechanical and thermal design of Annapurna ICs. – Engage with product architect and design teams on future products package and assembly needs – Perform package level thermal simulations. – Perform package level mechanical simulations. – Lead and design thermal and mechanical measurements of ICs. – Explore and provide recommendations on both available and future packaging and assembly technologies for Annapurna’s products.…