Advanced Packaging & Metallization Expert
Taipeionsite
Posted today · via Successfactors
About this role
Advanced Packaging & Metallization Expert Glass Core Program | Corning Incorporated Join a team pioneering glass-based solutions for next-generation semiconductor packaging. This role offers the opportunity to shape future technology platforms enabling AI, high-performance computing, and advanced electronics while working closely with leading customers and partners across the semiconductor industry. Corning is seeking an experienced Advanced Packaging & Metallization Expert to join the Glass Core development team as a senior individual contributor. This role will provide technical leadership in the development and commercialization of next-generation glass substrate technologies for AI, high-performance computing, networking, and advanced semiconductor applications.…
Read the full description on Corning Automotive Glass's site →
What we'd score you on
reqspace match rubricFive dimensions, recruiter-grade. Upload your resume and we'll generate a written explanation of where you fit and where the gaps are.
1
Skills match
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2
Level fit
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3
Domain experience
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4
Recency
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5
Location fit
This role is based in Taipei. We weight your proximity and willingness to relocate.
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