Wafer Bonding Process Engineer, Quantum AI
Goletaonsitemid
Posted today · via Google
About this role
Google Quantum AI is building quantum computing for otherwise unsolvable problems. The full potential of quantum computing will be unlocked with a large-scale computer capable of complex, error-corrected computations. Our roadmap is focused on advancing the capabilities of quantum computing and enabling meaningful applications. In this role, you will lead the development, integration, and Release to Production of temporary wafer bonding, thinning, and debonding (TB/DB) processes for Google Quantum AI’s next-generation quantum processors. Responsibilities include developing and implementing process flows featuring advanced adhesive bonding chemistries, manufacturable debonding systems, and thin-wafer handling.…
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Recency
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This role is based in Goleta. We weight your proximity and willingness to relocate.
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