InfineonBE OSAT DEV ATV CM

Senior Staff Engineer Package Technology Development

Penang (Malaysia)onsitestaff

Posted 4mo ago · via Eightfold

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About this role

Package Design and Development: Design and develop WB BGA, QFP and VQFN package technologies, ensuring optimal performance, reliability, and manufacturability for Automotive products. Your Role Key responsibilities in your new role Package Design and Development: Design and develop WB BGA, QFP and VQFN package technologies, ensuring optimal performance, reliability, and manufacturability for Automotive products. Technical Advisor: Provides technical guidance, actively shares knowledge, and promotes best practices to support OSAT partners and colleagues on package technology development. Technical Leadership: Drive technical decision-making and set direction within OSAT partners for the development and pre-development of new product or wafer technology qualified within package platform.…

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What we'd score you on

reqspace match rubric

Five dimensions, recruiter-grade. Upload your resume and we'll generate a written explanation of where you fit and where the gaps are.

Skills match

We compare your skills against the role requirements.

Level fit

This role is staff-level. We check your trajectory against it.

Domain experience

Your work in the role's domain matters more than your years total. We weight recent and direct experience.

Recency

A skill you used last quarter weighs more than one from five years ago. We grade on recency, not lifetime.

Location fit

This role is based in Penang (Malaysia). We weight your proximity and willingness to relocate.

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