Software Development and AI for Chip Package Board Codesign (w/m/div)
Villach (Austria)onsite
Posted 1mo ago · via Eightfold
About this role
#WeAreIn for jobs that impact everyone's life. Join the thinkers, builders, and problemsolvers behind tomorrow’s technology. Being responsible for Software Development and AI for Chip Package Board Codesign on our Research & Development team, you'll have the opportunity to merge creativity with your technical expertise by shaping the future of technology, driving groundbreaking projects, and bringing new ideas to life.…
What we'd score you on
reqspace match rubricFive dimensions, recruiter-grade. Upload your resume and we'll generate a written explanation of where you fit and where the gaps are.
1
Skills match
For this role: python, shell, pandas, pytorch, tensorflow
2
Level fit
We check your title trajectory against the seniority signal of the role.
3
Domain experience
Your work in the role's domain matters more than your years total. We weight recent and direct experience.
4
Recency
A skill you used last quarter weighs more than one from five years ago. We grade on recency, not lifetime.
5
Location fit
This role is based in Villach (Austria). We weight your proximity and willingness to relocate.
Score yourself on this role.
Free · no card · written explanation included
Skills in this role
Pulled from the job description. These are the keywords we'll weight when scoring your fit.
pythonshellpandaspytorchtensorflow
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