Advanced Packaging TD Plating Module Engineer
USonsitemid$134K – $255K
Posted today · via Workday
About this role
Job Details: Job Description: The Role and Impact As a Module Development Engineer, you will play an integral role in advancing Intel's semiconductor manufacturing capabilities. Your day-to-day responsibilities will focus on developing and optimizing advanced manufacturing processes, performing feasibility studies, and enabling high-volume manufacturing solutions for next-generation device architectures. By driving process innovation and collaborating across teams, your work will directly impact Intel's ability to deliver cutting-edge products and maintain its leadership in the semiconductor industry.…
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reqspace match rubricFive dimensions, recruiter-grade. Upload your resume and we'll generate a written explanation of where you fit and where the gaps are.
1
Skills match
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2
Level fit
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3
Domain experience
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4
Recency
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5
Location fit
This role is based in US. We weight your proximity and willingness to relocate.
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