C4 Bump Module Equipment Technician
Malaysiaonsite
Posted today · via Workday
About this role
Job Details: Job Description: Join Intel Malaysia's newest Advanced Packaging startup team in Penang and help shape the future of semiconductor manufacturing. As part of a factory ramp from the ground up, you will work with advanced wafer manufacturing and packaging technologies, collaborate with global engineering teams, and play a key role in bringing new capabilities into high-volume production. This unique opportunity offers unparalleled exposure to factory startup activities, rapid professional growth, and the chance to leave your mark on one of Intel's most significant manufacturing expansions.…
What we'd score you on
reqspace match rubricFive dimensions, recruiter-grade. Upload your resume and we'll generate a written explanation of where you fit and where the gaps are.
1
Skills match
For this role: teams
2
Level fit
We check your title trajectory against the seniority signal of the role.
3
Domain experience
Your work in the role's domain matters more than your years total. We weight recent and direct experience.
4
Recency
A skill you used last quarter weighs more than one from five years ago. We grade on recency, not lifetime.
5
Location fit
This role is based in Malaysia. We weight your proximity and willingness to relocate.
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