NMSI F11X Thin Films Module Engineer-Technologist

USonsitemid$164K – $232K

Posted today · via Workday

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About this role

Job Details: Job Description: Organization Overview Intel's Advanced Packaging organization bridges the critical gap between Technology Development (TD) and High-Volume Manufacturing (HVM), enabling the successful deployment of advanced technology nodes and process capabilities for product qualification and high-yield manufacturing. The team drives continuous technology advancement across multiple products while supporting the evolving needs of Intel Foundry customers. About the Role Join Intel's Advanced Packaging team as a Senior Technical Leader responsible for driving process innovation across Intel's most advanced semiconductor packaging technologies in volume manufacturing.…

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