Oregon Advanced Packaging Module Engineer
USonsitemid$76K – $146K
Posted today · via Workday
About this role
Job Details: Job Description: At Intel, we create world-changing technology that improves the life of every person on the planet. By joining the Oregon Advanced Packaging (ORAP) team—supporting both our Aloha and Ronler factories—you will become part of the Wafer Packaging Manufacturing (WPM) organization. Our mission is to deliver world-class manufacturing solutions through advanced wafer-level processes and packaging technologies, enabling high-volume production, supporting global technology transfer, and driving the innovations that shape the future of computing. We are seeking an Oregon Advanced Packaging Module Engineer to join our advanced manufacturing operations in Hillsboro, Oregon.…
What we'd score you on
reqspace match rubricFive dimensions, recruiter-grade. Upload your resume and we'll generate a written explanation of where you fit and where the gaps are.
1
Skills match
For this role: matlab, teams
2
Level fit
This role is mid-level. We check your trajectory against it.
3
Domain experience
Your work in the role's domain matters more than your years total. We weight recent and direct experience.
4
Recency
A skill you used last quarter weighs more than one from five years ago. We grade on recency, not lifetime.
5
Location fit
This role is based in US. We weight your proximity and willingness to relocate.
Score yourself on this role.
Free · no card · written explanation included
Skills in this role
Pulled from the job description. These are the keywords we'll weight when scoring your fit.
matlabteams
More at Intel
- View →GPU Design Verification EngineerUS, California, Folsom
- View →GPU Design Verification EngineerUS, California, Folsom
- View →AMHS Equipment TechnicianUS, Oregon, Hillsboro
- View →Senior / Staff Dry Etch Process Development EngineerUS, New Mexico, Albuquerque
- View →AR Collection AnalystPRC, Shanghai
- View →CPU Design Verification EngineerMalaysia, Penang