Packaging Module Development Engineer
USonsitemid$156K – $220K
Posted today · via Workday
About this role
Job Details: Job Description: The Role and Impact As a Module Development Engineer within Intel's Advanced Packaging Technology Development (APTD) Metrology Group, you will contribute to the development, optimization, and implementation of advanced metrology capabilities supporting Intel's next-generation semiconductor packaging technologies. Your work will combine hands-on equipment and process development, equipment qualification, manufacturing process optimization, and technology development initiatives. You will support both existing metrology operations and the evaluation of emerging technologies that enable future manufacturing capabilities.…
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