Packaging Module Development Engineer

USonsitemid$134K – $189K

Posted today · via Workday

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About this role

Job Details: Job Description: Intel's Substrate Packaging Technology Development (SPTD) organization is seeking a talented and driven Packaging Module Development Engineer to join our Arizona-based team. In this role, you will be at the forefront of developing cutting-edge packaging processes and equipment that enable Intel's next-generation semiconductor technologies. You will play a critical role in advancing heterogeneous integration and die disaggregation solutions that support Intel's global product roadmap — from high-performance computing to mobile applications.…

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