Packaging Module Equipment Development Engineer
USonsitemid$134K – $189K
Posted today · via Workday
About this role
Job Details: Job Description: At Intel, we create world-changing technology that improves the life of every person on the planet. This position is part of Intel's Advanced Packaging Technology Manufacturing (APTM) organization, which is dedicated to advancing and scaling innovative semiconductor packaging solutions. APTM's mission is to deliver state-of-the-art technologies that empower mobile, edge, and high-performance computing applications, while supporting Intel's broader goals of technological leadership and global customer success. We are seeking a Senior Packaging Module Development Engineer to join our team in Chandler, Arizona.…
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reqspace match rubricFive dimensions, recruiter-grade. Upload your resume and we'll generate a written explanation of where you fit and where the gaps are.
1
Skills match
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2
Level fit
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3
Domain experience
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4
Recency
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5
Location fit
This role is based in US. We weight your proximity and willingness to relocate.
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