• Senior Packaging Module Development Engineer

USonsitesenior$134K – $255K

Posted today · via Workday

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About this role

Job Details: Job Description: At Intel, we create world-changing technology that improves the life of every person on the planet. Join Intel's Substrate Packaging Technology Development (SPTD) organization, a global leader in developing advanced substrate and packaging solutions. Our team is dedicated to enabling Intel's roadmap of innovative packaging technologies, focusing on materials development, process optimization and simulation, and process equipment advancements. SPTD supports Intel's mission of delivering high-performance, cost-effective products that power the future of computing. We are seeking a Senior Packaging Module Development Engineer to join our team in Chandler, Arizona.…

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What we'd score you on

reqspace match rubric

Five dimensions, recruiter-grade. Upload your resume and we'll generate a written explanation of where you fit and where the gaps are.

Skills match

For this role: python, r, matlab, teams, split

Level fit

This role is senior-level. We check your trajectory against it.

Domain experience

Your work in the role's domain matters more than your years total. We weight recent and direct experience.

Recency

A skill you used last quarter weighs more than one from five years ago. We grade on recency, not lifetime.

Location fit

This role is based in US. We weight your proximity and willingness to relocate.

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Skills in this role

Pulled from the job description. These are the keywords we'll weight when scoring your fit.

pythonrmatlabteamssplit

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