Silicon Package Design Engineer
Indiaonsitemid
Posted today · via Workday
About this role
Job Details: Job Description: The Role and Impact: Join Intel as a Silicon Packaging Design Engineer, where you will be at the forefront of semiconductor innovation, driving the end-to-end development of cutting-edge substrate designs. In this role, you will perform substrate fit and routing studies to optimize performance, cost, and manufacturability while collaborating with customers and internal teams. Your contributions will directly impact the creation of Intel's advanced silicon packaging solutions, ensuring they meet electrical and manufacturing requirements. Business group: At Intel, the Assembly and Test Technology Development (ATTD) Design group plays a crucial role in advancing the company's semiconductor packaging technologies.…
What we'd score you on
reqspace match rubricFive dimensions, recruiter-grade. Upload your resume and we'll generate a written explanation of where you fit and where the gaps are.
1
Skills match
For this role: python, perl, split
2
Level fit
This role is mid-level. We check your trajectory against it.
3
Domain experience
Your work in the role's domain matters more than your years total. We weight recent and direct experience.
4
Recency
A skill you used last quarter weighs more than one from five years ago. We grade on recency, not lifetime.
5
Location fit
This role is based in India. We weight your proximity and willingness to relocate.
Score yourself on this role.
Free · no card · written explanation included
Skills in this role
Pulled from the job description. These are the keywords we'll weight when scoring your fit.
pythonperlsplit