Silicon Packaging Architect

Indiaonsite

Posted today · via Workday

See if I'm a fit →Tailor my resume for this role →Apply on Workday ↗

About this role

Job Details: Job Description: The Role and Impact: As a Silicon Packaging Architect, you will play a pivotal role in translationally directly contribute to advancing Intel's silicon packaging capabilities, ensuring reliability, quality, and innovation in every solution. Business group: Join Intel's Data Center Group (DCG), a dynamic organization driving innovation in the design and devg product requirements into advanced package architecture specifications and delivering end-to-end solutions that meet physical, electrical, thermal, and cost requirements. You will lead technology tradeoff decisions, ensuring silicon packages adhere to rigorous standards and collaborate closely with cross-functional teams to drive seamless execution from design to production.…

Read the full description on Intel's site →

What we'd score you on

reqspace match rubric

Five dimensions, recruiter-grade. Upload your resume and we'll generate a written explanation of where you fit and where the gaps are.

Skills match

For this role: teams

Level fit

We check your title trajectory against the seniority signal of the role.

Domain experience

Your work in the role's domain matters more than your years total. We weight recent and direct experience.

Recency

A skill you used last quarter weighs more than one from five years ago. We grade on recency, not lifetime.

Location fit

This role is based in India. We weight your proximity and willingness to relocate.

Score yourself on this role.

Free · no card · written explanation included

See if I'm a fit →

Skills in this role

Pulled from the job description. These are the keywords we'll weight when scoring your fit.

teams

More at Intel

See all open jobs at Intel →