Staff EMIB-T Substrate Yield Engineer
Taiwanonsitemid
Posted today · via Workday
About this role
Job Details: Job Description: Intel's APTM organization is seeking a highly driven Staff Technology Development Substrate Yield Engineer to drive supplier yield, defect reduction, technical issue closure, and process-control maturity supporting next-generation EMIB-T substrates across Taiwan suppliers. The team will be chartered to lead yield performance for next-generation advanced packaging technologies, including EMIB-T (Embedded Multi-die Interconnect Bridge with TSV), Intel's most advanced platform for heterogeneous integration partnering with substrate suppliers locally at the HVM factories.…
What we'd score you on
reqspace match rubricFive dimensions, recruiter-grade. Upload your resume and we'll generate a written explanation of where you fit and where the gaps are.
1
Skills match
For this role: teams, split
2
Level fit
This role is mid-level. We check your trajectory against it.
3
Domain experience
Your work in the role's domain matters more than your years total. We weight recent and direct experience.
4
Recency
A skill you used last quarter weighs more than one from five years ago. We grade on recency, not lifetime.
5
Location fit
This role is based in Taiwan. We weight your proximity and willingness to relocate.
Score yourself on this role.
Free · no card · written explanation included
Skills in this role
Pulled from the job description. These are the keywords we'll weight when scoring your fit.
teamssplit
More at Intel
- View →Ecosystem Technical Enabling EngineerTaiwan, Taipei
- View →AI Model Optimization EngineerUS, California, Santa Clara
- View →E-core CPU Full Chip Physical Design EngineerMalaysia, Penang
- View →E-core CPU Power Delivery EngineerMalaysia, Penang
- View →Packaging Module Development EngineerUS, Arizona, Phoenix
- View →Business Development Lead, Neuromorphic ComputingUS, California, Santa Clara
