Director / DMTS, Process Integration Lead – Advanced Packaging (2.5D/3D, HBM, Hybrid Bonding)

Boiseonsitedirector

Posted today · via Workday

See if I'm a fit →Tailor my resume for this role →Apply on Workday ↗

About this role

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: We are advancing the future of semiconductor packaging through innovative 2.5D, 3D, and heterogeneous integration technologies. Our team develops the processes that enable next-generation AI and high-performance computing products, working across materials, device, design, manufacturing, and test engineering to solve complex technical challenges.…

Read the full description on Micron Technology's site →

What we'd score you on

reqspace match rubric

Five dimensions, recruiter-grade. Upload your resume and we'll generate a written explanation of where you fit and where the gaps are.

Skills match

For this role: teams

Level fit

This role is director-level. We check your trajectory against it.

Domain experience

Your work in the role's domain matters more than your years total. We weight recent and direct experience.

Recency

A skill you used last quarter weighs more than one from five years ago. We grade on recency, not lifetime.

Location fit

This role is based in Boise. We weight your proximity and willingness to relocate.

Score yourself on this role.

Free · no card · written explanation included

See if I'm a fit →

Skills in this role

Pulled from the job description. These are the keywords we'll weight when scoring your fit.

teams

More at Micron Technology

See all open jobs at Micron Technology →