HBM PYE Product Development Failure Analysis Engineer
Boiseonsitemid
Posted today · via Workday
About this role
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron in Boise, Idaho has an opening for a HBM Product Yield Enhancement PDFA Engineer where you will work on the Product Development Failure Analysis team to take next generation HBM devices from design to mass production! This role can be entry level with a Master's Degree or equivalent experience, Senior level, or Staff level.…
What we'd score you on
reqspace match rubricFive dimensions, recruiter-grade. Upload your resume and we'll generate a written explanation of where you fit and where the gaps are.
1
Skills match
For this role: python, claude, teams
2
Level fit
This role is mid-level. We check your trajectory against it.
3
Domain experience
Your work in the role's domain matters more than your years total. We weight recent and direct experience.
4
Recency
A skill you used last quarter weighs more than one from five years ago. We grade on recency, not lifetime.
5
Location fit
This role is based in Boise. We weight your proximity and willingness to relocate.
Score yourself on this role.
Free · no card · written explanation included
Skills in this role
Pulled from the job description. These are the keywords we'll weight when scoring your fit.
pythonclaudeteams
More at Micron Technology
- View →NAND CAD Design Environment Development/Support EngineerTokyo, Japan
- View →Construction CSA EngineerHiroshima - Fab 15, Japan
- View →LPDDR Layout Design EngineerHashimoto, Japan
- View →PMO Cost ManagerTaichung - Fab 16, Taiwan
- View →New College Grad: Engineer, Edge Systems ArchitectureBoise, ID - Main Site
- View →Automation TechnicianSanand - 303A - AT/SSD/MOD, India
