Senior IC Packaging Process Engineer
Israelonsitesenior
Posted today · via Workday
About this role
At NVIDIA, we are committed to delivering exceptional solutions in a wide range of sectors, and we are looking for engineers who share our passion and dedication to making a difference in the world through their inventions. As a Senior Package Engineer, you will work closely with SI, layout, and ASIC design teams to develop complex, top-of-the-line ASIC packages. You will be responsible for planning schedules, resolving costs, packaging, manufacturing, and electrical design issues. What you'll be doing: Lead adhesive and bonding process development for advanced FCBGA packaging, including surface preparation, surface coatings and process optimization for applications requiring optical alignment and high dimensional stability.…
What we'd score you on
reqspace match rubricFive dimensions, recruiter-grade. Upload your resume and we'll generate a written explanation of where you fit and where the gaps are.
1
Skills match
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2
Level fit
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3
Domain experience
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4
Recency
A skill you used last quarter weighs more than one from five years ago. We grade on recency, not lifetime.
5
Location fit
This role is based in Israel. We weight your proximity and willingness to relocate.
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