Packaging development engineer

Kuala Lumpuronsitemid

Posted today · via Workday

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About this role

The Senior Flip-Chip Front-End Packaging Development Engineer – Die Attach & Underfill is responsible for leading FC-FE process development, optimization, and integration activities for die attach and underfill process. This role requires strong technical capability in process characterization, DOE, troubleshooting, yield improvement, material qualification, and equipment readiness to support packages development and production release. The engineer will work closely with cross-functional teams to ensure robust process performance, manufacturability, reliability, and continuous improvement across flip-chip packaging platforms. Process Ownership & Optimization Take ownership of FC-FE die attach and underfill processes for semiconductor packages, including advanced package platforms.…

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