RF Package Design Engineer, Senior Staff

Company: Qualcomm Technologies, Inc. Job Area: Engineering Group, Engineering Group > Packaging Engineering General Summary: This position is a senior leadership position responsible for leading the RF Package Design. The main role of this position is to focus on Electrical Characterization of RF Packages working with RF design leads. The RF-IC Package and system in package are for products to be used in 6G Infrastructure and 6G consumer devices including mobile phones. This position requires defining the packaging roadmap and project the resource needs and/or gaps to execute the roadmap. This position will oversee both design and advancing RF packaging roadmaps and develop/extend the company's technical capabilities.…