Qualcomm AutomotivePackaging Engineering

Senior Leader, Signal and Power Integrity/Systems Architecture (High-Speed Interconnects) - Multiple locations

San Diegoonsitesenior$257K – $385K

Posted 2mo ago · via Eightfold

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About this role

Company: Qualcomm Technologies, Inc. Job Area: Engineering Group, Engineering Group > Packaging Engineering General Summary: The Qualcomm Central Hardware Systems (CHS) team is seeking a Senior Leader, Electrical Systems Architect to define, develop, and productize next-generation high-speed electrical interconnect technologies for AI, hyperscale datacenter, networking, and HPC platforms. Locations include: Pacific Time Zone - Bay Area Remote; Portland Remote; Irvine Remote AND/OR Austin, TX The successful candidate will be a recognized technical leader with deep expertise in 224G/448G PAM4 signaling, SerDes architectures, Signal Integrity (SI), Power Integrity (PI), advanced packaging, PCB design, connector technologies, and end-to-end electrical system analysis .…

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Domain experience

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Location fit

This role is based in San Diego. We weight your proximity and willingness to relocate.

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