Q
Qualcomm AutomotivePackaging Engineering

Signal and Power Integrity Engineer, Senior to Staff Level

Hsinchu Cityonsitesenior

Posted 2mo ago · via Eightfold

About this role

Company: Qualcomm Semiconductor Limited Job Area: Engineering Group, Engineering Group > Packaging Engineering General Summary: Job Overview The Qualcomm CHS (Central Hardware System) team has exciting opportunities in the areas of Signal Integrity and Power Integrity (SIPI) for next-generation server projects. The candidate will work closely with IC, Package, and PCB designers to optimize overall system performance. The role involves partnering with substrate designers to ensure all system-level constraints are met before package tape-out and collaborating with PHY owners to understand requirements for various IPs such as LPDDR6, PCIe, and 224G interfaces. The candidate will also work with PCB designers to assess the impact of ball assignment on system-level performance.…

Read the full description on Qualcomm Automotive's site →

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reqspace match rubric

Five dimensions, recruiter-grade. Upload your resume and we'll generate a written explanation of where you fit and where the gaps are.

1

Skills match

For this role: matlab, rest, teams

2

Level fit

This role is senior-level. We check your trajectory against it.

3

Domain experience

Your work in the role's domain matters more than your years total. We weight recent and direct experience.

4

Recency

A skill you used last quarter weighs more than one from five years ago. We grade on recency, not lifetime.

5

Location fit

This role is based in Hsinchu City. We weight your proximity and willingness to relocate.

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Skills in this role

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