Sr. Packaging Engineer (Semiconductor)
IND - Hyderabadonsitesenior
Posted 3w ago · via Workday
About this role
Responsibilities: Lead Advanced Package Development: Define, develop, and qualify advanced package architectures (WLCSP, DFN, QFN, flip-chip, multi-die) for TVS, TDS, and Hot Switch protection products, ensuring electrical, thermal, and mechanical performance requirements are met across the full product portfolio. (25%) OSAT Partner Management: Serve as a technical interface with external assembly and test (OSAT) partners, supporting process capability improvements, applying established design rules, and helping ensure adherence to package specifications and quality standards across international manufacturing sites.…
What we'd score you on
reqspace match rubricFive dimensions, recruiter-grade. Upload your resume and we'll generate a written explanation of where you fit and where the gaps are.
1
Skills match
For this role: teams
2
Level fit
This role is senior-level. We check your trajectory against it.
3
Domain experience
Your work in the role's domain matters more than your years total. We weight recent and direct experience.
4
Recency
A skill you used last quarter weighs more than one from five years ago. We grade on recency, not lifetime.
5
Location fit
This role is based in IND - Hyderabad. We weight your proximity and willingness to relocate.
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