Head of Device Fabrication, Advanced Packaging and Assembly
Singaporeremotedirector
Posted 1mo ago · via Workable
About this role
At Universal Quantum, we are building the next generation of quantum computers - machines capable of solving problems once thought impossible. Our technology has the potential to transform industries from healthcare to aerospace, materials science, and beyond. As we scale from breakthrough R&D to global delivery, resilient execution becomes as critical as technical innovation. The Head of Device Fabrication, Advanced Packaging and Assembly is accountable for the development, industrialisation, and delivery of foundry processes, advanced packaging, and assembly technologies for quantum processors.…
What we'd score you on
reqspace match rubricFive dimensions, recruiter-grade. Upload your resume and we'll generate a written explanation of where you fit and where the gaps are.
1
Skills match
For this role: r, teams
2
Level fit
This role is director-level. We check your trajectory against it.
3
Domain experience
Your work in the role's domain matters more than your years total. We weight recent and direct experience.
4
Recency
A skill you used last quarter weighs more than one from five years ago. We grade on recency, not lifetime.
5
Location fit
This role is remote-eligible. We factor in your stated location and time-zone overlap.
Score yourself on this role.
Free · no card · written explanation included
Skills in this role
Pulled from the job description. These are the keywords we'll weight when scoring your fit.
rteams
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