Head of Device Fabrication, Advanced Packaging and Assembly

Singaporeremotedirector

Posted 1mo ago · via Workable

About this role

At Universal Quantum, we are building the next generation of quantum computers - machines capable of solving problems once thought impossible. Our technology has the potential to transform industries from healthcare to aerospace, materials science, and beyond. As we scale from breakthrough R&D to global delivery, resilient execution becomes as critical as technical innovation. The Head of Device Fabrication, Advanced Packaging and Assembly is accountable for the development, industrialisation, and delivery of foundry processes, advanced packaging, and assembly technologies for quantum processors.…

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1

Skills match

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2

Level fit

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3

Domain experience

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4

Recency

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5

Location fit

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