Advanced Packaging Dry Etch Module Development Engineer
USonsitemid$134K – $255K
Posted today · via Workday
About this role
Job Details: Job Description: We are seeking an experienced Plasma Etch Process Development Engineer to join our advanced packaging team. The successful candidate will be responsible for developing, optimizing, and implementing dry etch processes for next-generation semiconductor packaging technologies including 2.5D/3D integration, chiplet packaging, and heterogeneous integration solutions. Key Responsibilities - Develop and optimize plasma etch processes for advanced packaging applications - Design experiments (DOE) to characterize process windows and optimize etch performance - Develop and execute technology roadmaps to meet future manufacturing needs while pushing industry standards forward.…
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1
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2
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3
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4
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