Process Integration and Yield Technician

USonsite

Posted today · via Workday

About this role

Job Details: Job Description: We are part of the assembly and test technology development team based in Chandler, supporting advanced electronic packaging technology development. Our team directly supports quality and reliability failure analysis and also supports package material and assembly process development. The candidate will be responsible for conducting failure analysis to identify electrical failures, as well as physical failure analysis to support root cause understanding of new package technologies. Require setting up, operating and maintaining laboratory instruments, conducting experiments, making observations and documenting results, and often developing conclusions. Candidate should exhibit the following behavioral traits: • Verbal and technical writing skills.…

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What we'd score you on

reqspace match rubric

Five dimensions, recruiter-grade. Upload your resume and we'll generate a written explanation of where you fit and where the gaps are.

1

Skills match

For this role: electron

2

Level fit

We check your title trajectory against the seniority signal of the role.

3

Domain experience

Your work in the role's domain matters more than your years total. We weight recent and direct experience.

4

Recency

A skill you used last quarter weighs more than one from five years ago. We grade on recency, not lifetime.

5

Location fit

This role is based in US. We weight your proximity and willingness to relocate.

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Skills in this role

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electron

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