Packaging module development engineer
USonsitemid$99K – $189K
Posted today · via Workday
About this role
Job Details: Job Description: Join Intel's Advanced Packaging Technology Development team as a Packaging Module Development Engineer. In this pivotal role you will develop and optimize cutting-edge substrate processes and equipment to enable Intel's future packaging platform technologies. Your contributions will directly impact the manufacturability and reliability of next-generation products, addressing quality, cost, yield, and productivity requirements. Collaborate with cross-functional teams to tackle complex challenges, push boundaries, and innovate within a dynamic, fast-paced environment.…
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reqspace match rubricFive dimensions, recruiter-grade. Upload your resume and we'll generate a written explanation of where you fit and where the gaps are.
1
Skills match
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2
Level fit
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3
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4
Recency
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5
Location fit
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teams
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