Packaging Research and Development Engineer

USonsitemid$115K – $220K

Posted today · via Workday

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About this role

Job Details: Job Description: Substrate Packaging Technology Development (SPTD) is looking for a Packaging Research and Development Engineer to join the Module Engineering Backend Area specifically to be in charge of process and material development to scale advanced substrate packaging technology to enable further die disaggregation / heterogenous integration. This position requires most of time spent on the factory floor and/or interacting with equipment/material suppliers. The candidate will join and become part of a world class first of a kind embedded die packaging facility, learn advanced substrate manufacturing know-how, drive disruptive technology innovations, and be part of creating history in the substrate packaging industry.…

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What we'd score you on

reqspace match rubric

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Skills match

For this role: python, less, teams

Level fit

This role is mid-level. We check your trajectory against it.

Domain experience

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Recency

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Location fit

This role is based in US. We weight your proximity and willingness to relocate.

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Skills in this role

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