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HP

R&D Thermal Design Engineer — HP Workstations

Fort Collinsonsitemid$93K – $144K

Posted today · via Workday

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About this role

R&D Thermal Design Engineer — HP Workstations Description - About Us: HP Advanced Compute and Solutions (ACS) builds mission-critical workstations for professionals across a range of fields, including architecture, engineering, product design, financial services, medical equipment, defense, and AI development. Position: ACS R&D Thermal Design Engineer. Join the HP Workstation engineering team to develop thermal and acoustic solutions for high-performance systems. You will influence system architecture, fan-control strategy, acoustics, and reliability as new technologies move from concept to market. In this role, you will own thermal and acoustic development from early architecture through validation and product readiness, turning analysis and test results into practical system decisions.…

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What we'd score you on

reqspace match rubric

Five dimensions, recruiter-grade. Upload your resume and we'll generate a written explanation of where you fit and where the gaps are.

1

Skills match

For this role: r, teams

2

Level fit

This role is mid-level. We check your trajectory against it.

3

Domain experience

Your work in the role's domain matters more than your years total. We weight recent and direct experience.

4

Recency

A skill you used last quarter weighs more than one from five years ago. We grade on recency, not lifetime.

5

Location fit

This role is based in Fort Collins. We weight your proximity and willingness to relocate.

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