I
InfineonBE DEV PWR UPD DAC 1

Internship - Unit Process Development

Melakaonsitejunior

Posted 1mo ago · via Eightfold

About this role

Internship under Unit Process Development Your role Key responsibilities in your new role Support Engineer to run DOE on die clip attach process. Perform data collection and analysis of the DOE. Your profile Qualifications and skills to help you succeed Bachelor Degree in Engineering or any other related field. Minimum CGPA of 3.00 and above. Minimum 3 months of internship. Good analytical, problem-solving and communication skills Demonstrates knowledge in semiconductor industry. Demonstrates interest to learn new technology and tools #WeAreIn for driving decarbonization and digitalization.…

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What we'd score you on

reqspace match rubric

Five dimensions, recruiter-grade. Upload your resume and we'll generate a written explanation of where you fit and where the gaps are.

1

Skills match

We compare your skills against the role requirements.

2

Level fit

This role is junior-level. We check your trajectory against it.

3

Domain experience

Your work in the role's domain matters more than your years total. We weight recent and direct experience.

4

Recency

A skill you used last quarter weighs more than one from five years ago. We grade on recency, not lifetime.

5

Location fit

This role is based in Melaka. We weight your proximity and willingness to relocate.

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Free · no card · written explanation included
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