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InfineonBE OSAT DEV CEM PAD MOD

Module Package Technology Development/Definition Senior Staff or Principal Engineer – Based in Taiwan

Shanghaionsiteprincipal

Posted 5 days ago · via Eightfold

About this role

Module Package Technology Development/Definition Senior Staff or Principal Engineer – Based in Taiwan Your role Key responsibilities in your new role Develop and define package concepts for AI power-supply products, with an emphasis on high‑performance computing (HPC) modules. Validate proposed package concepts through simulation and hardware demonstrators, working closely with Back-End development, product development, and system architects. Coordinate and align new package ideas with Back-End development teams (internal and OSAT partners) and launch required assembly projects. Track and support package development projects through to final product release. Identify emerging development needs and translate them into additions/updates to the package roadmap.…

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What we'd score you on

reqspace match rubric

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1

Skills match

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2

Level fit

This role is principal-level. We check your trajectory against it.

3

Domain experience

Your work in the role's domain matters more than your years total. We weight recent and direct experience.

4

Recency

A skill you used last quarter weighs more than one from five years ago. We grade on recency, not lifetime.

5

Location fit

This role is based in Shanghai. We weight your proximity and willingness to relocate.

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