InfineonBE OSAT DEV CEM PAD MOD

Senior Staff Engineer Module Package Development

Muntinlupa Cityonsitestaff

Posted 5 days ago · via Eightfold

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About this role

Shape the future of semiconductor packaging for AI and High-Performance Computing. We’re looking for a Senior Staff Engineer to develop next-generation package concepts for AI power-supply and HPC applications . You’ll lead package definition from concept to product release, working across Back-End assembly, OSAT partners, simulation, reliability, SMT and module technologies . If you bring deep expertise in semiconductor packaging and assembly and want to turn innovative concepts into high-performance solutions, this could be your next opportunity. Your role Key responsibilities in your new role Develop and define package concepts for AI power-supply products , with an emphasis on High-Performance Computing (HPC) modules .…

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