Senior Staff Engineer Module Package Development

Responsible for developing and defining advanced semiconductor packaging solutions for AI power-supply and HPC applications, from concept and validation through product release. The role acts as the packaging technical expert, collaborating across internal teams and external partners to ensure package performance, manufacturability, reliability, and alignment with future technology and business needs. Your role Key responsibilities in your new role Develop and define package concepts for AI power-supply products, with an emphasis on high‑performance computing (HPC) modules. Validate proposed package concepts through simulation and hardware demonstrators, working closely with Back-End development, product development, and system architects.…