Module Engineer On Shift (MEOS)
USonsitemid$85K – $163K
Posted today · via Workday
About this role
Job Details: Job Description: Intel Corporation is one of the world's leading semiconductor companies, driving innovation that shapes the future of computing, connectivity, and intelligence. With decades of engineering excellence and a commitment to pushing the boundaries of what's possible, Intel develops the technologies that power everything from personal devices to data centers and AI systems. At Intel, we believe in the power of human ingenuity — and we're looking for bold, curious minds to help us build what's next. Are you passionate about semiconductor innovation and ready to make a real impact from day one? Intel's Epoxy MEOS team in Arizona is looking for a Packaging Module Development Engineer to join our growing team of packaging technology experts.…
What we'd score you on
reqspace match rubricFive dimensions, recruiter-grade. Upload your resume and we'll generate a written explanation of where you fit and where the gaps are.
1
Skills match
For this role: python, teams
2
Level fit
This role is mid-level. We check your trajectory against it.
3
Domain experience
Your work in the role's domain matters more than your years total. We weight recent and direct experience.
4
Recency
A skill you used last quarter weighs more than one from five years ago. We grade on recency, not lifetime.
5
Location fit
This role is based in US. We weight your proximity and willingness to relocate.
Score yourself on this role.
Free · no card · written explanation included
Skills in this role
Pulled from the job description. These are the keywords we'll weight when scoring your fit.
pythonteams
More at Intel
- View →Staff EMIB-T Substrate Yield EngineerTaiwan, Taipei
- View →Ecosystem Technical Enabling EngineerTaiwan, Taipei
- View →AI Model Optimization EngineerUS, California, Santa Clara
- View →E-core CPU Full Chip Physical Design EngineerMalaysia, Penang
- View →E-core CPU Power Delivery EngineerMalaysia, Penang
- View →Packaging Module Development EngineerUS, Arizona, Phoenix
