New Mexico Wafer Packaging Manufacturing Advanced Packaging Die Pick Engineering Group Leader

USonsite$121K – $232K

Posted today · via Workday

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About this role

Job Details: Job Description: The Role and Impact As a Module Engineering Manager, you will lead a team of engineers to support high-volume manufacturing processes and drive advancements within Intel's next-generation packaging technologies. You will oversee daily operations, facilitate continuous improvement initiatives, and execute engineering strategies that enhance safety, quality, and productivity. Your leadership will play a pivotal role in enabling Intel to deliver innovative, industry-leading products while fostering a collaborative and inclusive work environment. Business group Intel Corporation's Wafer Packaging Manufacturing (WPM) organization focuses on developing and sustaining advanced manufacturing processes to support Intel's high-volume production goals.…

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