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Intel

WPM Integration: Defect Engineer

USonsitemid$104K – $146K

Posted today · via Workday

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About this role

Job Details: Job Description: The Wafer Packaging Manufacturing organization is a global team at the heart of Intel's advanced packaging technology and high-volume manufacturing. Our vision is clear: optimize advanced packaging HVM processes end-to-end to maximize yield, quality, and customer satisfaction. WPM spans a broad and critical portfolio - including EMIB and Foveros wafer processing, TSV reveal, C4 bumping, Die Prep, and Wafer Level Assembly - supporting Intel's most strategic technologies across multiple sites worldwide As a WPM Advanced Packaging Defect Reduction Engineer, you will play a pivotal role in protecting yield and elevating defect performance across some of the world's most advanced semiconductor packaging processes.…

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1

Skills match

For this role: sql, mode, teams

2

Level fit

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3

Domain experience

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4

Recency

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5

Location fit

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