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Intel

Silicon Packaging Design Engineer

USonsitemid$91K – $173K

Posted today · via Workday

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About this role

Job Details: Job Description: The Opportunity Join Intel's advanced packaging team and help shape the future of high-performance computing. As a Silicon Packaging Design Engineer, you will be responsible for the design and development of next-generation package substrates that enable industry-leading semiconductor products. Working closely with silicon, signal integrity, power delivery, manufacturing, and hardware teams, you will drive substrate solutions from initial concept through tapeout, balancing electrical performance, manufacturability, cost, and schedule requirements. This role offers the opportunity to influence cutting-edge packaging technologies that support Intel's most advanced products and platforms.…

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What we'd score you on

reqspace match rubric

Five dimensions, recruiter-grade. Upload your resume and we'll generate a written explanation of where you fit and where the gaps are.

1

Skills match

For this role: python, c++, teams, split

2

Level fit

This role is mid-level. We check your trajectory against it.

3

Domain experience

Your work in the role's domain matters more than your years total. We weight recent and direct experience.

4

Recency

A skill you used last quarter weighs more than one from five years ago. We grade on recency, not lifetime.

5

Location fit

This role is based in US. We weight your proximity and willingness to relocate.

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Skills in this role

Pulled from the job description. These are the keywords we'll weight when scoring your fit.

pythonc++teamssplit

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