Senior Manager, Die Bond Product Engineering
Hong Kongonsitemanager
Posted 1w ago · via Workday
About this role
About the role: If you are passionate about pushing technical boundaries while leading teams to deliver real impact in the field, this is your opportunity to make it happen. We are looking for a driven Die Bond Product Engineering Manager to lead the next generation of die attach technology, shaping how our equipment performs in real customer applications. In this role, you will own the intersection of machine innovation, process expertise, and customer success, turning complex semiconductor requirements into cutting‑edge, high‑performance solutions.…
Read the full description on MY61 Nexperia Malaysia's site →
What we'd score you on
reqspace match rubricFive dimensions, recruiter-grade. Upload your resume and we'll generate a written explanation of where you fit and where the gaps are.
1
Skills match
For this role: r, teams
2
Level fit
This role is manager-level. We check your trajectory against it.
3
Domain experience
Your work in the role's domain matters more than your years total. We weight recent and direct experience.
4
Recency
A skill you used last quarter weighs more than one from five years ago. We grade on recency, not lifetime.
5
Location fit
This role is based in Hong Kong. We weight your proximity and willingness to relocate.
Score yourself on this role.
Free · no card · written explanation included
Skills in this role
Pulled from the job description. These are the keywords we'll weight when scoring your fit.
rteams