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NxpSenior Principal Packaging Engineer
Chandler (Office)onsiteprincipal
Posted today · via Workday
About this role
The Semiconductor Packaging Engineer will serve as an experienced technical lead within NXP’s Package Innovation organization, defining and delivering package solutions for new products and new technologies across NXP business lines. This role provides standard and advanced packaging solutions to support NXP markets including vehicle electrification and power management, robotics, and high-performance compute/datacenters, with focus on analog and power delivery. Job Summary: Define package architectures, materials, structures, and assembly process flows that meet product requirements for reliability, performance, manufacturability, and cost.…
What we'd score you on
reqspace match rubricFive dimensions, recruiter-grade. Upload your resume and we'll generate a written explanation of where you fit and where the gaps are.
1
Skills match
We compare your skills against the role requirements.
2
Level fit
This role is principal-level. We check your trajectory against it.
3
Domain experience
Your work in the role's domain matters more than your years total. We weight recent and direct experience.
4
Recency
A skill you used last quarter weighs more than one from five years ago. We grade on recency, not lifetime.
5
Location fit
This role is based in Chandler (Office). We weight your proximity and willingness to relocate.
Score yourself on this role.
Free · no card · written explanation included