MEOS - Module Engineer On Shift

USonsitemid$99K – $140K

Posted today · via Workday

See if I'm a fit →Tailor my resume for this role →Apply on Workday ↗

About this role

Job Details: Job Description: Assembly and Test Technology Development (ATTD) Microelectronic Packaging Engineers provide project management, package design/development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units. Key Responsibilities Prioritize and organize daily activities around multiple requests for engineering DOEs, pre-ops meeting preparation, documentation and AR tracking, and quick and effective response to production issues. Be experts in all tools and processes in the area to support elaborate DOEs and NPIs. Be able to coach and role model the correct execution of module operations.…

Read the full description on 500 Intel Ireland's site →

What we'd score you on

reqspace match rubric

Five dimensions, recruiter-grade. Upload your resume and we'll generate a written explanation of where you fit and where the gaps are.

Skills match

For this role: teams

Level fit

This role is mid-level. We check your trajectory against it.

Domain experience

Your work in the role's domain matters more than your years total. We weight recent and direct experience.

Recency

A skill you used last quarter weighs more than one from five years ago. We grade on recency, not lifetime.

Location fit

This role is based in US. We weight your proximity and willingness to relocate.

Score yourself on this role.

Free · no card · written explanation included

See if I'm a fit →

Skills in this role

Pulled from the job description. These are the keywords we'll weight when scoring your fit.

teams

More at 500 Intel Ireland

See all open jobs at 500 Intel Ireland →