Module Development Engineer
USonsitemid$134K – $189K
Posted today · via Workday
About this role
Job Details: Job Description: The Role and Impact Intel's advanced packaging technology development organization is seeking a Module Development Engineer to support the development of next-generation semiconductor packaging technologies, with a focus on 3D Integrated Circuit (3D IC) technology and advanced manufacturing processes. In this role, you will contribute to the development, evaluation, and optimization of semiconductor manufacturing processes that enable future technology generations. Working closely with engineering and manufacturing teams, you will help develop innovative process solutions, address complex technical challenges, and support the introduction of new technologies into the factory.…
What we'd score you on
reqspace match rubricFive dimensions, recruiter-grade. Upload your resume and we'll generate a written explanation of where you fit and where the gaps are.
1
Skills match
For this role: python, teams
2
Level fit
This role is mid-level. We check your trajectory against it.
3
Domain experience
Your work in the role's domain matters more than your years total. We weight recent and direct experience.
4
Recency
A skill you used last quarter weighs more than one from five years ago. We grade on recency, not lifetime.
5
Location fit
This role is based in US. We weight your proximity and willingness to relocate.
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Skills in this role
Pulled from the job description. These are the keywords we'll weight when scoring your fit.
pythonteams
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